LG Electronics will introduce changes in the cooling market for AI (artificial intelligence) data centers and integrated cooling solutions to address them. The company plans to highlight the importance of cooling technology driven by increasing AI demand and performance changes in graphics processing units (GPUs), and present technical solutions covering the entire data center cooling process.
At the two-day conference of “Smart Energy Plus (SMART ENERGY PLUS·SEP) 2026,” scheduled for the 29th at Hall B of COEX in Seoul Gangnam-gu, Lee Gwang-won, head of LG Electronics’ Applied Business Division, will deliver a presentation titled “Global Data Center Trends and End-to-End LG Integrated Cooling Solutions.”
The division head will examine the impact of expanding AI demand and GPU evolution on the global AI data center (AIDC) cooling market. As the performance of GPUs responsible for AI computing increases, server heat generation is surging, and cooling technology is becoming more advanced. In particular, there is a growing trend emphasizing the importance of liquid cooling technology alongside existing air-cooling methods.
In line with these market changes, LG Electronics is unveiling an integrated solution using the “Chip to Chiller” approach that covers the entire data center cooling process. The structure connects everything from chillers that produce coolant to coolant distribution units (CDUs) that manage heat generated by semiconductors, and cold plates that directly cool semiconductors. A key feature is the integrated provision of technology ranging from data center cooling equipment to the semiconductor area inside servers. The division head plans to introduce LG Electronics’ major cooling solutions and application cases in this presentation.
Following its acquisition of Nvidia certification for 600 kW (kilowatt)-class CDUs last July, LG Electronics also received “DSX Ready” approval for high-capacity CDUs in September. “DSX Ready” is a certification granted to products that meet the technical requirements for liquid cooling systems for AI data centers as specified by Nvidia. LG Electronics is strengthening its product lineup of liquid cooling solutions for AI data centers by expanding certifications for individual products.
Meanwhile, “SEP 2026” is an event co-hosted by MoneyToday and COEX, and organized by the National Assembly Hydrogen Economy Forum, taking place from the 28th to the 30th at Hall B of COEX. LG Group, HD Hyundai Electric, Doosan Enerbility, Hyundai Rotem, Unison, the Army, Seoul City, and the Korea Atomic Energy Research Institute, among others, will set up booths to showcase energy security strategies for the AI era. Strategies for electric vehicles and hydrogen vehicles from Hyundai Motor, BMW, Mercedes-Benz, Audi, Porsche, and Polestar can also be reviewed.
At the conference, senior executives from Samsung Electronics, SK Hynix, Hyundai Motor, LG Electronics, POSCO Holdings, Bright Energy Partners, LG Energy Solution, Samsung SDI, SK On, OCI Power, and HD Hyundai Electric are scheduled to speak.
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