Samsung Electronics has unveiled a wide range of next-generation solutions that consolidate its integrated capabilities in AI (artificial intelligence) semiconductors.
On the 14th, Samsung Electronics announced that it is participating in 'Korea Semiconductor Daejeon (SEDEX) 2026,' held at COEX in Gangnam-gu, Seoul through the 16th, to showcase key semiconductor products and solutions for various AI applications. SEDEX is the largest domestic specialized semiconductor exhibition, organized by the Korea Semiconductor Industry Association.
This year, under the theme 'Architecting AI Systems,' Samsung Electronics structured its exhibition space into six zones covering next-generation technologies, cloud, edge, and physical AI, semiconductor clusters, and collaborative growth. Based on integrated capabilities spanning memory, logic design, foundry, and advanced packaging, it presented semiconductor products tailored to specific AI applications.
In the memory sector, exhibits included 7th-generation high-bandwidth memory (HBM4E), LPDDR (low-power DRAM)-PIM integrating computing functions, zHBM (mock-up) based on a 3D memory architecture, and zNAND-O (model), a 3D NAND solution optimized for edge AI. The foundry (semiconductor contract manufacturing) division showcased an HBM4E base die based on a 4-nanometer process and ultra-high-density packaging technology based on silicon bridges. The System LSI division presented the 'DIMM Solution,' the 200th-megapixel image sensor 'ISOCELL HPC,' and the mobile processor 'Exynos 2600.'
The newly established semiconductor cluster zone highlighted the development plan for the Yongin National Industrial Complex. The company is pushing forward with plans to invest approximately 360 trillion won in the Yongin complex, aiming to begin construction in 2027 and start operations of its first production line in October 2029. The collaborative growth zone introduced achievements in mutual growth over the past 45 years since the founding of the Hyosung Association in 1981, along with various support programs covering funding, technology, personnel, and education.
in INDUSTRY
