LG Innotek has joined forces with NVIDIA to develop the latest sensing solutions for physical AI (artificial intelligence) and robotics.
LG Innotek announced that it unveiled a lineup of sensing solutions incorporating NVIDIA’s latest Holoscan Sensor Bridge (HSB) technology, including a 3-megapixel camera module and a multimodal vision system (MVS), at “GTC Berlin,” held in Berlin, Germany on the 20th (local time).
HSB is NVIDIA’s proprietary technology that transmits information collected by sensors directly to AI computers without passing through a CPU (central processing unit), serving as a core technology that aids the rapid information processing of physical AI such as autonomous vehicles and robots.
The two companies plan to expand their collaboration on HSB-based solutions, including vision sensing for humanoid robots and robot hands, and develop integration solutions for NVIDIA’s next-generation platform to be showcased at “CES 2027” and “GTC,” the world’s largest IT and home appliance exhibition, next year.
An LG Innotek official stated, “This collaboration once again proves LG Innotek’s world-class optical design capabilities accumulated in the fields of mobile, autonomous driving, and robotics, as well as its composite sensing technology that encompasses cameras, LiDAR, and radar.” The official added, “Through this collaboration, we will be able to broaden our connections with global physical AI companies utilizing NVIDIA’s platform and expand opportunities for supplying cameras and sensing solutions equipped with HSB technology.”
Meanwhile, LG Innotek is collaborating with Aeva, Applied Intuition, and Kakao Mobility in the autonomous driving sector. In the robotics field, it is developing components with Boston Dynamics and has begun mass production of camera modules for North American customers at its Yangsan plant, accelerating its push into physical AI business operations.
Moon Hyeok-su (President) stated, “This collaboration presents a great opportunity to expand LG Innotek’s differentiated composite sensing solutions into the global market.” The official added, “As a ‘Physical AI Total Solution Provider’ encompassing not only sensing but also communication modules and semiconductor substrates, we will rapidly secure a leading position in the physical AI solution market.”
Meanwhile, LG Innotek is aiming to transform into a “Physical AI Total Solution Provider” that covers sensing and connectivity transmission modules as well as semiconductor substrates. Through this, the company plans to grow its new business revenue to 5.94 billion dollars (approximately 8 trillion won) by 2030 and expand its revenue share to 25%.
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