Hanmi Semiconductor achieved simultaneous growth in revenue and improved profitability in the third quarter of this year, driven by expanding demand for advanced packaging equipment for AI (artificial intelligence) semiconductors.
On the 30th, Hanmi Semiconductor disclosed that it recorded consolidated revenue of 181 billion won and an operating profit of 90.8 billion won in the third quarter of this year. Revenue and operating profit increased by 8.9% and 33.9%, respectively, compared to the same period last year.
The operating profit margin reached 50.2%, a 9.4 percentage point increase from the third quarter of last year (40.8%). Despite a decline in exchange rates and delays in revenue recognition for some equipment, the company continued its growth driven by a revenue structure centered on high-value-added AI semiconductor packaging equipment.
The earnings growth was led by demand for advanced equipment such as TC bonders for high-density HBM (High Bandwidth Memory) and new TC/FC bonders for large-area AI package processes. Hanmi Semiconductor holds the world No. 1 position in the markets for HBM TC bonders, Micro Solder & Vision Placement (MSVP), and EMI (Electromagnetic Interference) shield equipment.
Hanmi Semiconductor is also accelerating its efforts to capture overseas markets. With an average overseas revenue share of over 72%, Hanmi Semiconductor established a local subsidiary, "Hanmi USA," in San Jose, California, this month. The company plans to increase local equipment supply in response to the expansion of semiconductor and advanced packaging investments within the United States by Tesla, SpaceX, and xAI's TerraFab project, as well as Micron, SK hynix, Intel, and Amkor Technology.
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