
Samsung Electronics is officially launching cooperation with ASML, the Netherlands-based company and the world's sole manufacturer of extreme ultraviolet (EUV) lithography equipment, often referred to as the "super underdog" in the semiconductor industry, to develop next-generation DRAM.
On the 8th, Samsung Electronics announced its participation in the "Large Mask Consortium" led by ASML to jointly develop next-generation 12-inch photomasks. This consortium is a collaborative body established to transition from the 6th-inch photomasks currently used in semiconductor lithography equipment to 12-inch masks, conducting joint research and standard development. While global foundry leader Taiwan TSMC and U.S. Intel are also part of the same consortium, Samsung Electronics stands out as the only global company capable of both memory semiconductor production at its Yangsan facility and foundry services.
A photomask is a precision "mask (template)" intricately engraved with microcircuit patterns, playing a critical role in transferring "designed patterns" onto wafers (thin circular discs used to make semiconductor chips) via light within lithography equipment. The challenge of transitioning from the 6th-inch masks used for decades to 12-inch masks carries far-reaching implications. When using existing 6-inch masks, additional processes such as stitching—dividing circuits and reconnecting them—are required, but 12-inch masks can largely eliminate this need, thereby boosting productivity and improving yield rates. This makes it a key enabler for next-generation semiconductor production.
Additionally, Samsung Electronics will apply ASML's next-generation lithography equipment, High NA (high numerical aperture) EUV, to its Yangsan LINE in 2028 for memory manufacturing—the first time globally. By incorporating more precise circuit patterns than current EUV technology, this move is expected to extend DRAM miniaturization roadmaps while simultaneously achieving process simplification and productivity gains.
Jeon Young-hyun, Executive Vice Chairman of Samsung Electronics, emphasized: "Samsung Electronics will continue its leadership in advanced semiconductor manufacturing, including foundry and memory, based on innovative technologies and strong partnerships. By further strengthening cooperation with ASML, we will lay the technological foundation for 'Next AI'."
Christophe Fouquet, CEO of ASML, stated: "As we welcome a new era led by AI, we look forward to driving innovation in next-generation semiconductor manufacturing together with Samsung Electronics."